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product configuration: silicon monolithic integrated circuit the product is not designed for radiation resistance. 1/26 tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 14? 001 datashee t hrp7 htsop-j8 constant current led drivers 50v 500ma 1ch source driver for automotive bd8374hfp-m bd8374efj-m general description bd8374hfp-m and bd8374efj-m are 50v-withstanding led source drivers. most suitably for automotive led driving, it can control lig ht through pwm of constant current output. having led open/short protective circuit and overvoltage mute functions integrated, it can deliver high reliability. also by utilizing our patented pbus function, it is possible to turn off all leds in case where a row of leds are short/open-circuited if multiple rows of leds are driven through multiple number of the ics. features ? aec-q100 qualified ? variable form constant-current source driver ? pwm dimming function ? cr timer for pwm dimming function integrated ? led open/short protective circuit function integrated ? overvoltage mute and temperature protection functions integrated ? abnormal output detection and output functions (pbus) application ? on-board exterior lamp (rear lamp, turn lamp, drl/position lamp, fog lamp, etc.) ? on-board interior lamp (air conditioner lamp, interior lamp, cluster light, etc.) key specifications ? input voltage range: 4.5v to 42v ? max output current: 500ma (max) ? output current accuracy: 5% (max) ? operating temperature range: -40c to +125c packages w(typ) x d(typ) x h(max) hrp7 9.395mm x 10.540mm x 2.005mm htsop-j8 4.90mm x 6.00mm x 1.00mm basic application circuit figure 1. typical application circuit
2/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 1 2 3 4 8 7 6 5 vin_f vin n.c. gnd iout crt disc pbus (top view) 1234567 pbus disc crt gnd iout vin_f vin (top view) pin configurations figure 2. hrp7 package pin configuration figure 3. htsop-j8 package pin configuration pin descriptions hrp7 package htsop-j8 package block diagram figure 4. block diagram pin no. pin name function 1 pbus error detection i/o 2 disc discharge setting 3 crt pwm dimming timer setting 4 gnd gnd 5 iout current output 6 vin_f output current detection 7 vin power supply input pin no. pin name function 1 vin_f output current detection 2 vin power supply input 3 n.c. n.c. 4 gnd gnd 5 pbus error detection i/o 6 disc discharge setting 7 crt pwm dimming timer setting 8 iout current output fin(gnd) fin(gnd)
3/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 absolute maximum ratings (ta=25c) parameter symbol rating unit supply voltage v in 50 v vin_f,crt,disc,iout,pbus terminal voltage v vin_f ,v crt ,v disc ,v iout ,v pbus 50 v power dissipation pd hrp7 2.3 (note1) w htsop-j8 1.1 (note2) operating temperature range topr -40 125 c storage temperature range tstg -55 150 c junction temperature tjmax 150 c iout output maximum current i out 500 ma (note1) hrp7 derate by 18.4mw/c when operating above ta=25c (when mounted in rohm?s standard board(70mm 70mm 1.6mm) 2 layer copper foil(15mm 15mm)). (note2) htsop-j8 derate by 8.8mw/c when operating above ta=25c (when mounted in rohm?s standard board(70mm 70mm 1.6mm) 2 layer copper foil(15mm 15mm)). caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol rating unit supply voltage (note1) v in 4.5 42.0 v operating temperature range topr -40 125 c current setting resistor r vin_f 0.36 3.6 ? pwm minimum pulse width t min 100 s (note1) pd, aso should not be exceeded
4/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 electrical characteristics (unless otherwise specified ta=-40 125c, v in = 13v, r vin_f =0.47 ? , r pbus =10k ? ) parameter symbol min typ max unit condition circuit current i vin - 2.1 6.0 ma iout terminal output current accuracy i out 373 383 393 ma ta = 2 5 c 364 383 402 ma ta = - 4 0 c 125c vin ? iout drop voltage v dr_iout - 0.45 1.0 v i out =383ma iout terminal off current i iout_off - - 1 a v iout =2v, v crt =0.7v ta = 2 5 c iout current at gnd short i iout_short - - 40 a v iout =0v vin_f terminal voltage v in_f_ref 0.171 0.180 0.189 v v in_f_ref =v in -v in_f iout voltage at led open detection v iout_open v in -0.15 v in -0.050 v in -0.020 v iout voltage at led short detection v iout_ short 0.2 0.6 1.0 v crt terminal charge current i crt_so 29.75 35.00 40.25 a v crt =0.9v crt terminal charge voltage v crt_cha 0.990 1.10 1.21 v crt terminal discharge voltage 1 v crt_dis1 2.7 3.0 3.3 v crt terminal discharge voltage 2 v crt_dis2 3.6 4.0 4.4 v r d1<-> r d2 (note1) crt terminal charge resistance r cha 51.6 54.3 57.0 k ? r cha =(v crt_dis1 v crt_cha ) / i crt_so disc terminal discharge resistance 1 r d1 - 50.0 100 ? v crt =3.4v disc terminal discharge resistance 2 r d2 2.5 5.0 10 k ? v crt =5v pbus terminal input voltage high v ih_pbus 4.0 - v in +0.20 v pbus terminal input voltage low v il_pbus gnd -0.20 - 2.0 v pbus terminal low voltage v ol_pbus - - 1.5 v i pbus =2ma pbus terminal input current i in_pbus - 38.0 100 a v pbus =13v overvoltage mute v in_ ovpmute 27 29 33 v v iout =6v (note) this product is not designed for use in radioactive environments. (note1) refer to functional description
5/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 typical performance curves (reference data) (unless otherwise specified ta=25c, v in =v in_f =13v) figure 7. temperature vs v in_f_ref figure 8. v in vs v in_f_ref figure 5. r vin_f vs i out 0.170 0.172 0.174 0.176 0.178 0.180 0.182 0.184 0.186 0.188 0.190 -50 -25 0 25 50 75 100 125 150 v in_f_ref [v] temp[c] 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0 1020304050 v in_f_ref [v] v in [v] 0 50 100 150 200 250 300 350 400 450 500 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 i out [ma] r vin_f [ ? ] figure 6. r vin_f vs i out i out =(i out /(0.18v/r vin_f )-1) 100[%]
6/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 6.50 6.55 6.60 6.65 6.70 6.75 6.80 6.85 6.90 6.95 7.00 -50 -25 0 25 50 75 100 125 150 pwm on-duty[%] temp[c] 30 31 32 33 34 35 36 37 38 39 40 1.01.21.41.61.82.02.22.42.62.83.0 i crt_so [a] v crt [v] figure 10. temperature vs pwm on duty c crt =0.033 f, ? r crt =3.9k ? (on-duty 6.7% setting) figure 9. v crt vs i crt_so (v crt :crt terminal voltage) ta = - 4 0 c ta=25c ta=125
7/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 [a] r v r )v(v i vin_f in_f_ref vin_f in_fin out ? ? ? functional description (unless otherwise specified, ta=25c, v in =13v, i out =6v and r vin_f =0.47 ? . numbers are "typical" values.) 1. output current setting led current i out can be set as below depending on values of current setting resistance r vin_f . where: v in_f_ref is 0.18v (typ.) figure 11. output current setting 2. table of operations pwm dimming mode switches to linear control depending on crt terminal voltage. when crt terminal voltage surpasses v crt_dis2 (4.0v(typ)), dimming mode tu rns to linear control, and discharge resistance of disc terminal changes from r d1 (50 ? (typ)) to r d2 (5k ? (typ)). led open/short-circuit protection is activated depending on iou t terminal voltage status, and output current is turned off. output current is also turned off wh en low signal is input to pbus terminal. operation mode crt terminal iout terminal voltage (v iout ) output current (i out ) pbus terminal linear control 4.0v(typ) v crt - 50ma 500ma hi-z pwm dimming open - see features description, 3. pwm light control operation hi-z led open - 12.95v v iout 1 a(max) low output led short - v iout 0.6v 1 a(max) low output pbus control off - - 1 a(max) low input
8/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 [s] i c ?v t1 crt_so crt crt ? ? 3. pwm dimming operation pwm dimming is performed if crt terminal is open. dimming cycle and duty width can be set through external resistance value and capacity. cr timer function in ic is activated if crt terminal turned open. in order to perform pwm light control of led current, triangular waveform is generated at crt terminal. output is controlled so that led current is turned off while crt voltage is ramping up, and led current is turned on while crt voltage is ramping down. ramp up/down time of crt voltage can be set by values of external components (c crt , r disc ). figure 12. pwm fimming operation (1) crt ramp up time t1 crt ramp up time can be obtained from the following equations: where: i crt_so is the crt terminal charge current 35 a (typ) vref iout vin v in -0.180v (typ) gnd vin_f osc crt disc i crt =35a(typ) 50? (typ) +b i out c crt r crt crt voltage ramp-up crt voltage ramp-down crt terminal waveform i out waveform
9/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 [s] v v ln)rr(ct2 crt_dis1 crt_cha d1 crt crt ? ? ? ? ? ? ? ? ????? [hz] 2t1t 1 f pwm ? ? 2t1t 2t d on ? ? (2) crt ramp down time t2 crt ramp down time is defined by discharge period due to external capacity c crt and resistance (r crt + r d1 ). make sure that t2 is set at not smaller than min. pulse width 100 s(min). where: r d1 is the crt terminal discharge resistance 1 50 ? (typ) v crt_cha is the crt terminal discharge on voltage 1.1v (typ) v crt_dis1 is the crt terminal discharge on voltage 1 3.0v (typ) (3) dimming frequency f pwm pwm frequency is defined by t1 and t2. (4) on duty (d on ) like the above, pwm on duty is defined by t1 and t2. (ex) in case of f pwm = 518hz and 6.7% duty (typ), from f pwm =518hz; t1 + t2 = 1 / f pwm = 1 / 518hz = 1931 s from on duty = 6.7%; crt ramp up time t1 is t1 = (t1 + t2) 0.933 = 1801.6 s external capacity c crt is; c crt = t1 (i crt / ? v crt ) = 1800.7 s 35 a / 1.9v P 0.033 f crt ramp down time t2 is; t2 = (t1 + t2) 0.067 = 129 s external resistance r crt is; r crt = t2 / (c crt ln(v crt_cha / v crt_dis )) r d1 = 129usec / (0.033 f ln(1.1 / 3.0) ? 50 ? P 3.9k? in case where pwm signal is applied from external; it is possible to directly input pwm signal from external microcomputer for dimming. input pwm signal to crt terminal. in that case, ?h? leve l voltage of pwm signal should be equal to or higher than v crt_dis2( 4.0v(typ)). figure 13. external input of pwm signal vref iout vin v in -0.180v (typ) gnd vin_f osc crt +b pwm signal input
10/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 4. led setting range number of led connections n shoul d meet the following conditions: v f_led n +b ? v f_diode ?v in_f_ref ?v dr_iout where: +b is the battery voltage v f_diode is the reverse connection preventing diode vf v in_f_ref is the vin_f terminal voltage (v in ? v in_f ) v dr_iout is the iout terminal drop voltage v f_led is the led vf n is the number of led levels ex) if you want to supply constant current to led at 9v or higher battery voltage (+b) (supposing that v f_diode is 0.5v), v f_led n +b ? v f_diode v in_f_ref v dr_iout = 9v ?0.5v ?0.189v(max) ? 1.0v(max) = 7.311v (sum of vf of led connected to iout terminal is set to be 7.311v max.) figure 14. led setting range schematic 5. overvoltage mute if 29v (typ) v in , overvoltage mute is activated to restrict output cu rrent in order to suppress heat generated from ic. i out attenuates by 3.2%/v(typ). figure 15. overvoltage mute performance v f_led n v in_f_ref v f_diode i out
11/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 6. protective function in this ic integrated is a function for protection from short/ open-circuit of external component, and it is possible to detect abnormal condition at pbus terminal. (1) led open detective function in case where led connected to iout terminal is open-circ uited, it is detected due to overvoltage of iout terminal. during the detection, pbus terminal is switched to low to notify the trouble. figure 16. led open detection (2) led short-circuit detective function in case where led connected to iout terminal is short-ci rcuited, it is detected due to low voltage of iout terminal. during the detection, output current is turned off to pr event thermal destruction of ic, and pbus terminal is switched to low to notify the trouble. figure 17. led short-circuit detection vref iout vin gnd vin_f current control + - short pbus 0.6v (typ) off signal off
12/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 7. pbus function pbus terminal is an input/output terminal for out putting trouble and inputting trouble detection. in case where a trouble occurred due to open/short-circuit of ex ternal component, it is possible to notify the trouble outside by switching pbus terminal output from high (note1) to low. it is possible to turn off output current by externally controlling pbus from high low. (note1) pbus terminal is an open drain terminal. even when used separately, please be pulled up(10k ? ) to power supply voltage. in case where you use multiple number of th is lsi to drive multiple leds, as shown in the drawing below, it is possible to turn off all rows of leds even if some leds are shor t/open-circuited by connecting pbus terminal of each ch. figure 18. pbus function example of protective operation by led open figure 19. example of protective operation if led open occurs, pbus of ch1 is switched from hi- z to low output. as pbus becomes low, led drivers of other ch detect the trouble and turns off their own leds. viout clamps to 1.4v (typ) during the off period, in order to prohibit ground fault detection. trouble occurs connect pbus of each ch possible to turn off all leds led open ? output voltage is brought up when led open occurs. ? led current turns off. ? pbus output become low. ? turns off led current of other ch. clamp to 1.4v during off clamp to 1.4v during off
13/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 timing chart figure 20. timing chart ? if pwm_in is switched on, v crt will start oscillation, and according to its waveform led current i out is output. (pwm light control mode) ? if dc_in is switched on, v crt will be fixed at high (v in -vf). led current i out will be continuously output. (linear control mode) ? if led becomes open, led current i out will stop. at the same time, v pbus falls to low. ? if led is short-circuited to gnd, led current i out will stop. at the same time, v pbus falls to low.
14/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 guaranteed range of current accuracy and led open detection range guaranteed range of current accuracy and led open detec tion range can be obtained from the following equation: pbus output becomes low if iout terminal output (v iout ) is higher than the led open dete ction range at the time of reduced voltage. therefore, pay attention to respective setting range during power on/off, and consider operating voltage range of the set. guaranteed range of current accuracy +b v f_diode + v f_led n + v in_f_ref + v dr_iout [v] where: +b is the battery voltage v f_diode is the reverse connection preventing diode vf v f_led is the led vf n is the: number of led levels v in_f_ref is the vin_f terminal voltage (v in - v in_f ) v dr_iout is the iout terminal drop voltage led open detection range v iout +b - v f_diode - 50mv(typ) figure 21. guaranteed range of current accuracy and led open detection range voltage waveform current waveform pbus waveform guaranteed range of current accurac y led open detection range (led current)
15/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 how to connect led connect led to iout terminal as shown in the following. note that protective detection becomes possi ble/impossible depending on connection patterns. (1 series) (2 or more parallels) (2 para llels or more, matrix connection) figure 22. led connection patterns connection pattern led short-circuit detection (gnd short of iout terminal) led open detection 1 series detectable detectable- 2 parallels or more detectable non-detectable (note 1) 2 parallels or more (matrix connection) detectable non-detectable (note 2) (note1) : detectable only when one or more leds become open in all rows. (note2) : detectable only when all leds on the same level become open. 1st level 2nd level 3rd level 1st ro w 2nd row nth ro w
16/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 recommended application circuit figure 23. recommended application circuit corresponding emc test items ? iso11425-2 ? iso11452-4 ? iso7637-2 (pulse1, pulse 2a,2b, pulse 3a,3b) no. component name component value product name company 1 d1 - rf201l2s rohm 2 d2 - rf201l2s rohm 3 d3 - rf201l2s rohm 4 z d1 - tnr12h-220k nippon chemicon 5 c vin 4.7f gcm32er71h475ka40 murata 6 r vin_f 0.91? mcr10 series rohm 7 r pbus 10k ? mcr03 series rohm 8 c crt 0.033f gcm188r11h333ka40 murata 9 r crt 3.9k ? mcr03 series rohm 10 c iout 0.1f gcm188r11h104ka42 murata table 1. bom list pwm_in dc_in mode low low off high low pwm dimming mode (n o t e 1 , n o t e 2) (14ma 6.7% on duty@518hz) low high linear control mode (n o t e 2) (200ma 100% on duty) high high linear control mode (n o t e 2) (200ma 100% on duty) (note1) see functional description "3. pwm dimming operation." (note2) see functional description "2. table of operations." table 2. table of operations figur e 24. example of waveform measurement vin_f vin crt disc pbus iout gnd bd8374hfp-m bd8374efj-m d1 d2 d3 z d1 c vin r vin_f c crt r crt r pbus c iout +b dc_in pwm_in fin
17/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 thermal loss figure 25. application circuit diagram for thermal description thermal design should meet the following equation: pd > pc = (+b ? v f_diode - v in_f_ref ? v f_led n)i out + i vin v in pd = (1/ ja) (tjmax - ta) or (1/ jc) (tjmax - tc) where: pd is the power dissipation pc is the power consumption +b is the battery voltage v f_diode is the reverse connection preventing diode vf v in_f_ref is the vin_f terminal voltage (v in -v in_f ) v f_led is the led vf n is the number of led levels i out is the output current i vin is the circuit current v in is the power supply voltage ja is the thermal resistance between tj and ta jc is the thermal resistance between tj and tc tjmax is the max joint temperature (150c) ta is the ambient temperature tc is the case surface temperature v f_led n v in_f_ref v f_diode i out vin_f vin crt disc pbus iout gnd bd8374hfp-m bd8374efj-m d1 d2 d3 z d1 c vin r vin_f c crt r crt r pbus c iout +b dc_in pwm_in fin
18/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 5.0 0.0 4.0 0 25 50 75 100 125 150 temp ta [ ] power dissipation pd [w] 4.16w 2 layer copper foil 50mm x 50mm ja = 30 /w 3.0 2.0 1.0 2.3w 1.6w 2 layer copper foil 15mm x 15mm ja = 54.4 /w 1 layer ja = 78.1 /w 2.0 0.0 0 25 50 75 100 125 150 temp ta [ ] power dissipation pd [w] 1.0 2 layer copper foil 50mm x 50mm ja = 69 /w 2 layer copper foil 15mm x 15mm ja = 113.6 /w 1 layer ja = 153.2 /w 0.82w 1.1w 1.81w hrp7 package htsop-j8 package (caution1) when mounted with 70.0mm x 70.0mm x 1.6mm glass epoxy substrate. (caution2) above copper foil area indicates backside copper foil area. (caution3) value changes according to number of substrate layers and copper foil area. note that this value is a measured value, not a gua ranteed value. figure 26. thermal dissipation curve
19/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 thermal design for few number of led lamps if there are few led lamps, insert resistance between iout terminal and led to reduce heat generation from ic and dissipate heat. (this does not apply where amperage is low.) in that case, note that guaranteed range of current accuracy will be as shown in the following equation: +b v f_diode + v f_led n + v in_f_ref + v dr_iout +i out r1 v f_diode is the reverse connection preventing diode vf v f_led is the led vf n is the number of led levels v in_f_ref is the vin_f terminal voltage (v in - v in_f ) v dr_iout is the iout terminal drop voltage i out is the output current r1 is the thermal dissipation resistance thermal design should meet the following equation when inserting thermal dissipation resistance: pd = (1/ ja) (tjmax - ta) or (1/ jc) (tjmax - tc) pd is the power dissipation pc is the power consumption +b is the battery voltage v f_diode is the reverse connection preventing diode vf v in_f_ref is the vin_f terminal voltage (v in - v in_f ) v f_led is the led vf n is the number of led levels i out is the output current r1 is the thermal dissipation resistance i vin is the circuit current v in is the power supply voltage ja is the thermal resistance between tj and ta jc is the thermal resistance between tj and tc tjmax is the max joint temperature (150c) ta is the ambient temperature tc is the case surface temperature figure 27. example of how to connect thermal dissipation resistance v f_diode v in_f_ref v f_led n thermal dissipation resistance
20/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 i/o equivalence circuits (hrp7 package) number terminal name equivalence circuit 1 pbus vin (7pin gnd (4pin pbus (1pin 2 disc 3 crt 4 gnd - 5 iout 6 vin_f 7 vin -
21/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lin es of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guarantee d under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong elec tromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
22/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 operational notes ? continued 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure xx. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that ex ceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other than protecting the ic from heat damage.
23/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 ordering information bd8374hfp - mtr package hfp:hrp7 packaging and forming specification m: high reliability design tr: embossed tape and reel (hrp7) bd8374efj - me2 package efj:htsop-j8 packaging and forming specification m: high reliability design e2: embossed tape and reel (htsop-j8) marking diagrams htsop-j8(top view) d8374 part number marking lot number 1pin mark hrp7 (top view) bd8374hfp part number marking lot number 1pin mark
24/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 physical dimension, tape and reel information(bd8374hfp-m) package name hrp7
25/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 physical dimension, tape and reel information(bd8374vefv-m) package name htsop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
26/26 datasheet datasheet bd8374hfp-m bd8374efj-m tsz02201-0g1g0c700310-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.06 rev.001 www.rohm.com tsz22111 ? 15? 001 revision history date revision changes 6.aug.2013 001 new release
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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